Symposium discusses future of advanced packaging industry

Market figures illustrate this trend: “According to our estimates, advanced packaging revenues represented more than $22bn in 2016 and will increase to almost $30bn by 2020”, confirmed Jérôme Azemar.

What is the status of the advanced packaging industry? Who is leading the market today? What are the platforms that will drive the tomorrow’s industry? What could we expect in term of technology evolution? NCAP China and Yole are putting on a two day conference to answer these questions and provide the opportunity to meet the advanced packaging leaders. They have announced the third Advanced Packaging & System Integration Technology Symposium, taking place in Wuxi, China, on 20^th-21^st April 2017.

Created in 2014, the Advanced Packaging & System Integration Technology Symposium is attracting more and more attendees each year. Designed by Yole and NCAP China, the programme gathers numerous valuable discussions, meetings and business collaborations.

This year again, the Symposium will welcome the leaders of the advanced packaging industry. Yole and NCAP China have announced a list of executive speakers which includes:

• Tetsukazu Sugiya, Group Leader, Technology Solutions Group at DISCO
• Lianming Tong, Lead Marketing Manager at Dow Electronics Materials
• Kenji Kawada, Staff Engineer at Infineon Technologies Japan
• Daquan Yu, CTO & VP, Kunshan Huatian Technology Electronics
• Howard Huang, Director, Kingyoup Optronics
• Tae-Hoon Kim, Ex. President, nepes Corporate
• Dr David Lishan, Principal Scientist at Plasma-Therm
• Richard Barnett, Etch Product Manager, SPTS, an Orbotech Company

The 2017 edition also includes two keynote speakers from Huawei and Brewer Science. The partnership between NCAP China and Yole was signed three years ago and all benefits of this collaboration are serving the development of the advanced packaging industry in China and all around the world. 

“We are very pleased to have the opportunity this year again to host the Advanced Packaging & System Integration Technology Symposium,” commented Dr Cao LiQiang, CEO, NCAP. He added: “Mixing together worldwide companies and laboratories, all experts in the advanced packaging arena is just key for the development of the industrial activities in China. It is a relevant contribution to shape the future of the advanced packaging ecosystem. Under this context, we are looking forward to welcome advanced packaging leaders and get powerful presentations and debates during the Symposium”.

Advanced packaging revenue in China is expected to reach $4.6bn in 2020 at a 16% CAGR.

“Indeed we are experiencing a key momentum in the semiconductor industry," announced Thibault Buisson, Business Unit Manager, Advanced Packaging & Semiconductor Manufacturing at Yole. “Lots of technical challenges are now being transferred from the chip to the package itself. This is why industrial companies from different business models are willing to get involved in the exciting advanced packaging field. Under a highly competitive landscape, innovative platforms such as FO packages, 3D & 2.5D interposers and SiP are getting more and more interest from the end users and therefore are changing the packaging ecosystem. NCAP China & Yole Symposium is the place to get a clear understanding of the status of this industry and get answers to future market evolutions, the industry will face tomorrow”.

The symposium represents an opportunity for advanced packaging companies to develop, exchange and expand their activities in China and also in all other countries.