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Summit addresses thermal management for the IoT

12th August 2015
Jordan Mulcare
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The 15th annual coolingZONE Thermal Management Summit  for electronics thermal engineers take place from 20th to 22nd October, 2015 in a globally-accessible, online summit covering thermal management, heat transfer and energy transport at all hardware levels from individual components to the IoT.

The coolingZONE-15 Summit comprises expert live speakers from a range of thermal specialties. Every speaker will answer audience questions during or after their webinars. In coolingZONE tradition, the summit’s goal is to provide more than formulas, including practical answers to questions about theory and applications.

A key focus of this year’s event is on cooling technologies for the IoT. Speakers will address the full spectrum of cooling from wearables to data centres (the cloud).

Across the three days of general presentations, engineers will gain a deeper understanding of electronics cooling across many thermal topics, including:

  • Data Center Predictive Real Time Thermal Management, presented by Dr. Cliff Federspiel;
  • Computer Server Open Bath Immersion Cooling, presented by Phil Tuma;
  • The IceCool DARPA Project, presented by Dr. Mehdi Asheghi;
  • Liquid Cooling of 10Kw Racks, presented by Henry Coles;
  • Heat Pipes, presented by Dr. Rahul Mulinti; and
  • Cooling Wearables and Handhelds with Flexible Thermal Ground Planes, presented by Dr. Y.C. Lee.

coolingZONE-15 also offers two separate technical courses: Thermosyphons: How to Properly Size, Choose and Deploy by Vineet Barot and Analytical Modeling in Thermal Management Design by Dr. Kaveh Azar.

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