SEMICON Taiwan 2023 kicks off with press conference

5th September 2023

SEMI

Harry Fowle

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Industry luminaries gathered for a press conference to kick off SEMICON Taiwan 2023 with companies from across the electronics design and manufacturing supply chain coming together for insights into the latest trends, developments and innovations driving industry growth. Registration is open for the exhibition and conferences, 6^th – 8^th September 2023, at TaiNEX 1 and 2 in Taipei.

“The semiconductor industry has entered a new era of opportunities for global cooperation to solve some of its greatest challenges,” Terry Tsao, President of SEMI Taiwan and SEMI Chief Marketing Officer, said at the conference. “Achieving net zero carbon emissions, building the workforce of the future and ensuring supply chain resilience as the chip industry drives toward $1 trillion in annual revenue will require nothing less than a whole-industry effort. We look forward to hosting industry experts and visionaries from around the world at SEMICON Taiwan 2023 to focus on these and other key opportunities for the chip industry ecosystem to fulfil its tremendous potential.”

Tsao was joined at the press conference by Tsung-Tsong Wu, Minister of the National Science and Technology Council (NSTC); Tien Wu, CEO of ASE; Doris Hsu, Chairperson and CEO of GlobalWafers; and John Lee, Managing Director of Merck Group in Taiwan.

The largest SEMICON Taiwan ever, the event is expected to draw more than 50,000 attendees while featuring 3,000 booths and 850 exhibitors. Themed Inspire Innovation. Empower Sustainability, SEMICON Taiwan 2023 will offer more than 20 forums spotlighting critical industry topics including: