SEMICON Japan 2024 to open doors

With more than 1,000 exhibitors from 35 regions, the conference gathers leaders from across the microelectronics manufacturing supply chain from December 11-13. SEMICON Japan 2024 will spotlight smart semiconductor applications for automotive, Internet of Things (IoT), and more, emphasising industry insights, trends, and innovations that are powering the next wave of digital transformation. Registration is open.

Themed Strong Together, this year’s SEMICON Japan will feature two new events, including the Advanced Design Innovation Summit (ADIS) that will detail the future of semiconductor design and verification. Additionally, the inaugural SEMI Global Standards Summit will look at future advancements of semiconductor manufacturing and industry standardisation strategies focusing on three important themes: Smart Manufacturing for Future Factories, Packaging Architectures & Materials, and Environmental Sustainability.

“Japan’s focus on worldwide semiconductor industry collaboration and its critical role in the broader supply chain solidify it as a key region for innovation,” said Jim Hamajima, President of SEMI Japan. “SEMICON Japan will expand opportunities to connect with leaders across the global industry to further accelerate the pace of technological developments in growing sectors such as AI, automotive, IoT, 5G, and more. As the world becomes increasingly digital, SEMICON Japan is bringing the industry together to drive the next wave of groundbreaking technology.”

Notable speakers at the SuperTHEATER, SEMICON Japan’s biggest stage, will include:

• Akira Amari: Former Member of the House of Representatives Honorary Chairman, Diet Members Caucus for the Promotion of Semiconductor Strategy
• Tetsuro Higashi: Chairperson of the Board, Rapidus Chairman, Leading-Edge Semiconductor Technology Center
• Jim Keller: CEO, Tenstorrent
• Makiko Eda: Managing Executive Officer, Chief Sustainability, DE&I Officer, Sumitomo
• Dario Gil: Senior Vice President and Director of IBM Research, IBM
• Ho-Young Son: Vice President of Advanced Package Development, SK hynix
• Terushi Shimizu: Representative Director, President and CEO, Sony Semiconductor Solutions

Concurrent events with SEMICON Japan 

• Advanced Packaging and Chiplet Summit (APCS): This summit will include an exhibition area for technologies that support 2.5D, 3D, redistribution layers, through silicon vias, chiplets, and more. APCS will also feature networking opportunities and conference sessions led by the world’s top industry players.
• FLEX Japan: This event will bring device and material suppliers together with vendors who provide the final products, with the goal of creating new business opportunities within the flexible device and printed electronics sectors.

Other SEMICON Japan highlights

• Workforce Development Programs: SEMICON Japan’s workforce development programs will include Mirai College at SEMICON*, where 51 semiconductor-related companies will gather to help attendees learn about the industry. In addition, 70 universities* from across Japan will share their latest research and provide collaboration opportunities for those in academia.
• Technology Pavilions: The many technology pavilions at SEMICON Japan include the Quantum Computing, Ministry of the Environment, Power Electronics, Clean Room, and SEMI Sustainability HUB pavilions. Each pavilion will feature targeted exhibitions related to their focus area.
• Interactive Attractions: To help encourage semiconductor industry interest among the younger generation, SEMICON Japan will feature Yoichi Ochiai’s Passion Lab, an interactive discussion led by media artist, Yoichi Ochiai. In addition, SEMICON STADIUM will allow attendees to see, touch, and experience semiconductors through sports-playing AI robots, such as AI basketball robot “CUE6” (Toyota Motor Corporation), table tennis robot “Forpheus” (Omron), baseball swing analysis using Fujitsu Human Motion Analytics (Fujitsu), and the fastest robot to solve a puzzle cube “TOKUFASTbot” (Mitsubishi Electric).