SEMICON Europa to explore advanced packaging and fab management

The Advanced Packaging Conference (APC) and Fab Management Forum (FMF) at SEMICON Europa will each focus on driving sustainable solutions to meet the evolving demands of the semiconductor market. Co-located with electronica, SEMICON Europa is the region’s premier event connecting the entire electronics design and manufacturing supply chain. Registration is open for APC and FMF.

"Global collaboration across the semiconductor industry is essential for driving sustainable, exponential growth,” said Laith Altimime, President of SEMI Europe. ”SEMI Europe Advanced Packaging Conference and Fab Management Forum provide invaluable platforms for stakeholders to share insights and innovations, ensuring we leverage cutting-edge technologies and strategies that enhance performance while paving the way for a more sustainable future."

Advanced packaging conference

Chiplets and heterogenous integration: the next frontier in performance and efficiency demand for high performance computing (HPC) is increasing, driven by advancements in artificial intelligence and large language models like ChatGPT. HPC’s expansion requires innovative solutions in chiplet design, heat dissipation, and power optimisation. The upcoming APC will provide a platform to explore enhancing each of these developments, highlighting collaboration among academia, industry, and government.   

This year’s APC will focus on:

• The role of chiplets in enhancing performance and efficiency
• Power optimisation techniques for next-generation applications
• Advances in miniaturisation and material integration
• Innovations in heat dissipation and thermal management
• Collaborations across academia, industry, and government   

Speakers include experts from Amkor Technology, ASE Global, Atotech an MKS Brand, Besi, Chip Integration Technology Center (CITC), Comet Yxlon, EV Group (EVG), Evatec, GlobalFoundries, Guangdong Fenghua Semiconductor Technology, Henkel, IBM, Infineon Technologies, JCET, Koh Young Europe, QuantumDiamonds, RHP-Technology, RoodMicrotec, Robovision, STATS ChipPAC, and SUSS MicroTec.

The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, IBM, Koh Young Europe, and SUSS MicroTec.

Fab management forum

Driving innovation: competitive, sustainable, and collaborative strategies 

To meet its evolving demands, the semiconductor industry must adopt competitive, sustainable, and collaborative strategies that enhance fab efficiency and performance. Industry stakeholders can develop innovative solutions for a sustainable future by integrating cutting-edge technologies and fostering partnerships. 

This year’s FMF will focus on:

• Key strategies in a global market landscape
• Advancing smart manufacturing solutions
• Europe's environmental transition: stability to sustainability
• Next-gen core technologies for future fabs

Speakers include experts from Algorismic, ams OSRAM, BMW Group, Comet Yxlon, Flexciton, Infineon Technologies, INFICON, imec, Kontron AIS, minds.ai, Robert Bosch Semiconductor Manufacturing, STMicroelectronics, Synopsys, Texas Instruments, Tokyo Electron Europe, Watlow, and X-Fab.The forum is sponsored by Comet Yxlon, Flexciton, INFICON, Lynceus, Tokyo Electron Europe (TEL), and Watlow.

Other SEMICON Europa 2024 highlights

• CxO summit: top executives will share strategies for sustainable growth in Europe's semiconductor sector, focusing on navigating the evolving landscape through sustainability, supply chain resilience, and technological advancements.
• III-V summit – integrated photonics: this summit will examine the role of III-V compound semiconductors in advancing next-generation electronics, focusing on their impact on high-performance, energy-efficient devices in telecommunications, computing, and photonics.
• ITF chip into the future – powered by imec: this session will cover the EU Chips Act's implementation and impact on Europe's semiconductor ecosystem, highlighting collaborative research and innovations in chip design and manufacturing.
• MEMS and imaging sensors summit: this summit will explore recent advancements in MEMS and imaging sensor technologies, focusing on their impact on agriculture, automotive, and healthcare, along with the integration of AI, machine learning, and data fusion in next-generation applications.
• Executive forum programmes: these sessions will provide updates on key technological trends, including Silicon Carbide (SiC) power semiconductors, smart mobility solutions, and AI-driven manufacturing processes. Industry experts will also address sustainable energy and challenges related to electrification, presenting the latest innovations aimed at overcoming these obstacles.
• TechARENA programmes: focused on emerging technologies, TechARENA sessions will explore advancements in fields such as medical technology, quantum computing, and cyber security. The discussions will also address global challenges related to supply chain management, sustainability, and talent development, with an emphasis on the role of European research and innovation in driving the growth of the semiconductor industry.

Programs in halls C1, C2, and Entrance West are complimentary for all SEMICON Europa and electronica visitors.