SEMICON Europa: innovation and collaboration powering sustainable growth

Co-located with electronica, SEMICON Europa, Europe’s premier exhibition and conference for the microelectronics supply chain, will feature keynotes from the electronics design and manufacturing ecosystem, academia, and governments. Registration is open. 

"Leaders from across the value chain at SEMICON Europa will discuss innovations and collaboration strategies that are driving semiconductor industry growth in Europe and globally," said Laith Altimime, President of SEMI Europe. "The industry remains committed to ensuring harmony between technological advancement and environmental progress. We look forward to hosting visionaries as they offer insights into achieving sustainable growth and overcoming the talent gap."

A key highlight of the event, the CxO Summit, will bring together visionary leaders from across the value chain to discuss how Europe’s microelectronics ecosystem can collaborate to uphold strategic leadership. The Summit will serve as a stage for fostering insightful partnerships on pressing and emerging challenges throughout SEMICON Europa. Executives from AMS Osram, Bosch, Comet Group, Inficon, Porsche, Schneider Electric, Siemens, STMicroelectronics, and other leading companies will share insights on the critical issues shaping the foundation for sustainable exponential growth in the European semiconductor industry.

SEMICON Europa 2024 will feature the launch of the III-V Compound Summit that will showcase the critical importance and emerging impact of III-V compound semiconductors in driving the future of electronics.

“Advancements in III-V compound semiconductor materials are crucial for the next generation of high-performance, energy-efficient devices, supporting the industry to overcome manufacturing complexities, boost efficiency, and reduce costs,” said Ajit Manocha, SEMI President and CEO. “The III-V Compound Summit at SEMICON Europa will be an indispensable discussion in how these technologies will transform the electronics landscape, marking the beginning of a new era of technological progress.” 

Additional SEMICON Europa highlights

• ITF Chip into the Future – powered by imec: industry leaders will examine how the EU Chips Act can advance Europe’s semiconductor industry through collaboration, innovation, and investment. Discussions will cover key drivers, best practices, and the future of chip research and manufacturing.
• Advanced packaging conference: leading experts will discuss innovations in chiplets, heat dissipation, miniaturisation, and other advanced packaging techniques essential for meeting the high-performance computing demands of modern AI applications.
• Fab management forum: presenters will explore strategies to enhance semiconductor manufacturing efficiency and performance. Topics include global market strategies, smart manufacturing, innovations, environmental sustainability, supply chain resilience, and next-gen technologies.
• MEMS and imaging sensors summit: sessions will examine how advancements in MEMS and imaging technologies are enhancing connectivity and driving innovation across sectors such as agriculture, automotive, and healthcare, with a focus on the integration of AI/ML and data fusion in next-generation applications.
• SEMI networking night: industry stakeholders will gather to connect with peers and explore new business partnerships.

Executive Forum Programs 

• Cultivating a thriving SiC market: this session will feature insights from industry leaders addressing the challenges and solutions in Silicon Carbide (SiC) power semiconductors, crucial for automotive and AI applications. 
• Electrification and power semiconductors: examining key innovations in power semiconductors driving global electrification, this session will cover focus areas including efficiency, cost-performance, manufacturing technologies, and the role of semiconductors in advancing sustainable energy and electric vehicles. 
• Global automotive advisory council summit – smart mobility forum: addressing current challenges and opportunities in automotive semiconductor technology, this forum will bring together stakeholders and innovators to explore trends, such as autonomous, electric and software defined vehicle, towards a sustainable future in mobility. 
• Innovation showcase: attendees will learn about innovations in the microelectronics and semiconductor space.
• Integrated photonics: this session will explore how photonic integrated circuits (PICs) are transforming various industries by combining optical and electronic systems into compact, high performance, energy, and cost-efficient designs.
• Meet the SEMIs: session attendees will have opportunities to network with SEMI European Committee Members, exchange ideas, and discuss ways to advance the industry. 
• Smart manufacturing: this session will explore AI solutions for smarter semiconductor manufacturing operations, including data acquisition, digital twins, and autonomous production, with a focus on climate. 

TechARENA Programmes 

• 20 Under 30 Recognition Programme: the 2024 SEMI Europe 20 Under 30 will honour young leaders in the microelectronics supply chain for their career success, leadership, commitment, community involvement, and collaborative innovation.
• Advocacy and geopolitics: exploring the European Economic Security Strategy's impact on the semiconductor industry, this session will feature presenters discussing how new policies affect global supply chains and the need for international cooperation to ensure competitiveness and long-term growth.
• Breakthroughs in medical technology: this session will explore how advanced medical electronics and semiconductors are advancing digital healthcare for the future. 
• Building the talent pipeline – SEMI initiatives: session attendees will discover how SEMI initiatives are fostering a robust talent pipeline for the semiconductor industry through university partnerships, STEM outreach, ongoing training, and diversity programmes. 
• End-to-end cybersecurity: experts will come together to explore comprehensive solutions for securing semiconductor supply chains, protecting intellectual property, and ensuring product integrity in a connected world. 
• EU digital forum: partners from HiCONNECTS and other R&D EU-funded projects will demonstrate how innovative heterogeneous integration (HI) core technologies address major societal and technical challenges. 
• European projects for a diverse talent pipeline: speakers will highlight European Commission funded projects under the EU Chips Act aimed at addressing the urgent talent gap in the semiconductor industry by enhancing STEM education, re-skilling and up-skilling, promoting diversity, and sharing best practices in recruitment and onboarding. 
• Future disruptions: experts will share actionable insights and strategies on critical topics such as supply chain management, sustainability, ESG, PFAS regulations, and geopolitical impacts to navigate future disruptions in the semiconductor industry.
• Future of computing: this session will examine how advancements in quantum computing, neuromorphic computing, and trusted electronics are addressing global challenges and transforming the future of information processing with innovative solutions.
• Future of work: industry leaders will discuss how inclusive leadership can address the global talent shortage, develop the next generation of industry leaders, and foster a diverse and sustainable workforce.
• Materials innovation: this session will examine how innovations in materials are advancing Moore’s Law, supporting sustainable semiconductor manufacturing, and addressing global environmental challenges. 
• SCREEN─ innovation for a sustainable world: experts will present updates on new equipment platforms and solutions for Industry 4.0, 3D-Integration, and More-than-Moore devices, drawing from 25 years of collaboration with European partners. 

Tackling investment in semiconductors startups: this session will feature demonstrations on how European innovations are enabling future technology roadmaps and scaling up startups in the industry.