SEMI Korea Summit showcases future of advanced packaging
With advanced packaging a key enabler of semiconductor innovation, the stage is set for the ‚Advanced Packaging Summit‘ as industry pioneers and visionaries gather 5 September 2023 at the Suwon Convention Centre for insights into critical themes including advances in high-performance computing (HPC).
Representatives from chip manufacturing powerhouses such as AMD, Samsung Electronics, and SK hynix will join leading packaging providers and research institutions to present on topics including HPC interconnection technologies, 3D packaging, chiplets, HIR (Heterogeneous Integration Roadmap), Hybrid Bonding, LAB (Laser Assisted Bonding), and supply chain management during two sessions.
A key feature of the Advanced Packaging Summit, after each session one hour will be dedicated to in-depth discussions between speakers and conference attendees about technology, market and business trends and issues.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
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| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
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| Stock: | 8000 |
| Cost: | $5.42 |
