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Seica to showcase automation at SMT

22nd May 2024
Caitlin Gittins
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Automation and Smart Factory concepts are seamlessly integrated at Seica's booth 4A-120 at SMT in Nuremberg, where cutting-edge solutions cater to both.

The COMPACT line of test systems from Seica offers users the flexibility to select the most suitable configuration for current needs while ensuring scalability for future demands. The COMPACT NEXT systems cover a comprehensive range of test requirements, including in-circuit, pre-functional, functional, combinational, and onboard programming (OBP). At SMT, which is running from 11-13 June, visitors can explore two solutions designed to meet high throughput testing needs.

Robotic Process Automation (RPA) is increasingly prevalent in electronic board manufacturing, and Seica's latest board test solution, the Compact RT in the Next Series, is tailored for maximum productivity in RPA scenarios. Its dual-fixture rotary table guarantees continuous, optimised test throughput, while its modular design offers versatility for deployment in various automated handling setups (robot/cobot). Configurable and modular, this solution provides tailored test performance with the advantages of a standard platform.

In today's high throughput manufacturing environments, automated lines are standard, and the COMPACT SL NEXT> is engineered for easy integration into any line configuration. Fully automated with an advanced conveyor system and VIVA software management, it delivers the speed and flexibility needed to meet demanding throughput targets. Additionally, the integrated ATE BOOSTER module enhances LED test capability and OBP performance while optimising hardware resource utilisation, thus reducing costs.

The demand for LED test solutions has grown exponentially, and Seica will showcase the LedMeter, a SSeica's COMPACT line of test systems offers users the flexibility to select the most suitable configuration for current needs while ensuring scalability for future demands. The COMPACT NEXT systems cover a comprehensive range of test requirements, including in-circuit, pre-functional, functional, combinational, and onboard programming (OBP). At SMT, which is running from 11-13 June, visitors can explore two solutions designed to meet high throughput testing needs.

Robotic Process Automation (RPA) is increasingly prevalent in electronic board manufacturing, and Seica's latest board test solution, the Compact RT in the Next Series, is tailored for maximum productivity in RPA scenarios. Its dual-fixture rotary table guarantees continuous, optimised test throughput, while its modular design offers versatility for deployment in various automated handling setups (robot/cobot). Configurable and modular, this solution provides tailored test performance with the advantages of a standard platform.

In today's high throughput manufacturing environments, automated lines are standard, and the COMPACT SL NEXT> is engineered for easy integration into any line configuration. Fully automated with an advanced conveyor system and VIVA software management, it delivers the speed and flexibility needed to meet demanding throughput targets. Additionally, the integrated ATE BOOSTER module enhances LED test capability and OBP performance while optimising hardware resource utilisation, thus reducing costs.

The demand for LED test solutions has grown exponentially, and Seica will showcase the LedMeter, a Smart Tool developed specifically for this requirement. This cost-effective tool measures various parameters such as RGB, Hue, XY chromaticity, colour saturation, and relative intensity and wavelength in nanometres. With a modular architecture based on i2C communication, LedMeter offers scalability and ease of use.

Also featured at Seica's booth is the PILOT VX, setting a new standard in flying probe test technology. With state-of-the-art mechanical architecture and motion controllers, it achieves unparalleled test performance and speed, reducing test time by up to 50%. The PILOT VX platform includes options for testing flex circuits, electrical and optical testing of LEDs, and the innovative FlyStrain™ option for generating pressure/force topology maps.

All solutions at Seica's booth come with the VIVA NEXT software platform, enabling intelligent integration with various manufacturing processes, including data collection, traceability, MES interaction, and repair operations. Additionally, the Next> series systems are equipped with Canavisia's Industrial Monitoring solution for remote monitoring, predictive maintenance, and compatibility with Industry 5.0 standards.mart Tool developed specifically for this requirement. This cost-effective tool measures various parameters such as RGB, Hue, XY chromaticity, colour saturation, and relative intensity and wavelength in nanometres. With a modular architecture based on i2C communication, LedMeter offers scalability and ease of use.

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