Power electronics research at PCIM Asia Conference 2023

14th August 2023

PCIM Europe

Harry Fowle

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The PCIM conference for power electronics in Asia returns to Shanghai this year, gathering experts and academics from across the country and beyond to share the latest findings and technology within power electronics, intelligent motion, renewable energy and energy management. Highlighted areas include wide-bandgap devices, power semiconductors, packaging technology and more.

Taking place from 29^th – 31^st August 2023 at the Shanghai New International Expo Centre, PCIM Asia 2023 is expected to attract more than 180 exhibitors to showcase their latest advancements in power electronics technology. As a major part of the event, the PCIM Asia Conference is also set to bring together many leading scholars in the field to discuss the results of their research among an audience of their peers.

Keynote sessions

This year’s conference will once again feature several keynotes highlighting the latest power electronics trends, with expert speakers from China and overseas. Topics include:

The new generation of gallium nitride power devices; breaks the limits of ease of use and reliability

Speaker: Florin Udrea, Cambridge GaN Devices, UK

Packaging and integration of wide-bandgap power semiconductors: Challenges and opportunities

Speaker: Christina DiMarino, Virginia Polytechnic Institute and State University, USA

Power semiconductor devices in wind power applications

Speaker: Dapeng Zheng, Shenzhen Hopewind Electric, China

In addition, there will be a series of oral and poster sessions, presented by experts covering a wide range of power electronics areas. Topics featured will range from IGBT and SiC devices, advanced controls and associated hardware, Si and WBG devices, motion control, power converters, power semiconductor modules, automotive applications, packaging and reliability, high power and grid applications, power semiconductor devices and more.

In this year’s special session, representatives from Infineon Technologies and Rompower Energy Systems will deliver several presentations exploring different aspects of GaN based high power density supplies.

At the same time, a tutorial on high-performance power modules and SiC devices will also be held alongside. The session will aim to introduce the key concepts, principles and applications of power modules, SiC (Silicon Carbide) devices and discrete components. Participants will gain a deep understanding of the latest technologies and industry trends. Speakers will reveal how to design and apply high-performance power modules and SiC devices to meet the requirements of modern power conversion and energy management systems.

Three awards to celebrate power electronics achievements

The conference will once again host several awards to recognise the key players who contribute to the industry’s on-going innovation. Sponsored by Mitsubishi Electric & Electronics (Shanghai) Co Ltd, a panel of judges will decide the Best Paper Award for the most significant submission among all papers.

The “Young Engineer Award” will be awarded to engineers under the age of 35 for their contributions to power electronics. The award is sponsored by Semikron Danfoss and aims to encourage new blood to engage with power electronics and inject new ideas to maintain the industry’s dynamism and vitality.

Hand in hand with this is the “University Scientist Award” supported by Infineon Technologies China Co Ltd. The award is for teachers and researchers in academic institutions helping to foster the next generation of power electronics talent.