PCB inspection system to make debut at SMTAI 2014

The FX-940 offers multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part/polarity, through-hole parts, and co-planarity of chips, BGAs and other height sensitive devices. The system offers advanced Fusion Lighting and a comprehensive set of inspection tools for defect detection. The inspection tools include angled cameras, 3D height sensors, full color digital image processing, and both image- and rule-based algorithms.

The company's “capture-on-the-fly” imaging technology is used to provide high-speed inspection at over 30 sq. inches per second, or greater than 1.5 million components per hour. With one top-down viewing camera and four side-viewing cameras, the FX-940 provides full inspection and traceability capabilities at fast line speeds. Off-line programming maximises machine utilisation and real-time SPC monitoring provides a valuable yield management solution.