Nordson showcases at SEMICON China 2024

Plasma removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Fluid dispensing provides adhesion, structural integrity, thermal and electrical conductivity, and more in microelectronics manufacturing applications. 

Equipment in the booth includes:

• The MARCH FlexTRAK-CD plasma system delivers high-throughput plasma processing of strip-type components for semiconductor manufacturing applications, such as leadframe or laminate strips presented in magazines. Flexible chamber configurations support contamination removal, etching, and surface activation before die attach, wire bond, moulding and encapsulation, and underfill applications.
• The ASYMTEK Vantage fluid dispensing system is used for applications in wafer-level packaging and panel-level packaging during semiconductor manufacturing. The Vantage system dispenses precise, fine lines to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly. When configured with dual IntelliJet valves, using Nordson’s patented jetting technology, Vantage can dispense into gaps less than 200 microns, and up to 90,000 dots per hour.

Experts will be ready to answer questions, discuss industry trends, and help navigate the challenges of electronics manufacturing to enhance efficiency, precision, and reliability across projects.

SEMICON China will be held at the New International Expo Centre, Shanghai, China, 20–23 March 2024.  Nordson can be found at booth #3645 which is being shared with the Nordson Test and Inspection division.