Nihon will showcase soldering materials at SMTA

The company will be showcasing its TempSave series of low-temperature soldering materials, alongside its LF-C2 P608 solder paste.

The TempSave series has been developed to meet the industry’s demand for reduced peak reflow temperatures, aiming to minimise defects caused by package warpage, reduce energy usage during the reflow process, and prevent damage to temperature-sensitive components. The range includes TempSave B58, a eutectic SnBi alloy with a melting point of 139°C, suitable for wave soldering, and TempSave B37, a ductile hypoeutectic SnBi alloy that can be reflowed at a peak temperature of 190°C. Additionally, the TempSave B37 P611, a high-speed jetting paste, is available for consistent dot size application.

While high-bismuth alloys are often considered brittle and poor in drop shock performance, TempSave B37 stands out with exceptional drop performance, even surpassing the performance of SAC305. The P610 flux medium used with Bi alloys is entirely halogen-free, offering reliable performance.

Nihon Superior will also present its LF-C2 P608, a halogen-free, lead-free solder paste designed to minimise voiding. Automotive industry requirements for alloys capable of enduring extreme thermal cycling have often resulted in the development of hard alloys, which, although resilient to thermal cycling, tend to crack under other stresses. The LF-C2 balances these needs, providing durability during thermal cycling while remaining resistant to cracking, with a liquidus temperature of 213°C, allowing for reflow at a lower temperature than SAC305.

Also on display will be the SN100CV P608, a halogen-free, lead-free, no-clean solder paste. Unlike silver-containing alloys that rely on eutectic Ag3Sn particles for strength, the SN100CV gains its strength from solute atoms within the tin matrix. Despite being silver-free, the SN100CV alloy matches the tensile strength of SAC305 in tests.

Both SN100CV P608 and LF-C2 P608 offer excellent performance across a wide variety of component types and process parameters, with the P608 flux medium providing wetting capabilities comparable to halogen-containing pastes, despite being halogen-free.