AVX showcase its range of MLO diplexers at EuMW 2013

4th October 2013

AVX

Nat Bowers

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At European Microwave Week Exhibition in Nuremberg, Germany from 8th to 10th October 2013, AVX will be showcasing its range of MLO diplexers in Hall 7A on Stand 276. Based on its patented multilayer organic high density interconnect technology, AVX’s MLO diplexers incorporate high dielectric constant and low loss materials to realize high Q printed passive elements, such as inductors and capacitors in multilayer stack ups. The devices are available in 0805 and 0603 packages.

Only recently added to the range, the new low-profile 0603 diplexers from AVX are capable of supporting multiple wireless standards, including: WCDMA, CDMA, WLAN, GSM, and BT. The devices are ideally suited for band switching in dual- and multiband applications, such as WiFi, WiMax, GPS, and cellular bands.

Utilizing land grid array packaging technology, AVX’s 0603 diplexers have an inherently low profile (<0.5mm) and exhibit excellent solderability, low parasitics, and high heat dissipation. Expansion matched to PCBs, the diplexers also provide improved reliability with regards to comparable ceramic or silicon components.

“Our 0805 MLO diplexer, released earlier this year, has been well received within the RF industry, so we’re very pleased to now also have the smaller form available,” commented Callie Baldwin, Corporate Communications Director at AVX.

AVX’s 0603 MLO diplexer features a maximum power capacity of 4.5W, measures 1.65mm x 0.88mm x 0.42mm (0.065” x 0.035” x 0.017”), is rated for use in temperatures ranging from -40°C to +85°C, and is available in Ni Au, Ni Sn, and OSP finishes, all of which are compatible with automatic soldering technologies. Finished parts are 100% tested for electrical parameters and visual characteristics and are packaged on tape and reel.