Manufacturing solutions at SMT/Hybrid/Packaging

Under the slogan "Power on – switch on and get started!” Rehm will be presenting innovations and new solutions for modern and efficient electronics manufacturing. Visit us in hall A7, booth 451. The company will be presenting the following new systems:

The VisionXP+ convection soldering system combines numerous developments, especially with regard to the optimisation of energy efficiency and emissions reduction.With this system, customers can save up to 20% energy and reduce their average annual CO₂ consumption by about 10 tonnes. The vacuum option makes convection soldering processes with or without vacuum possible for the first time – in one system! The VisionXP+ Vac reliably removes gas bubbles and voids during the pre-soldering process, while the solder is still in an optimal molten state.With a vacuum of up to 2 mbar, void rates of less than 2% are possible.

Small batch sizes? Low throughput? For every electronics manufacturer, it is important to achieve high quality in assembly production, even at low throughput.This means optimal process performance for reproducible soldering results, which must be reliably implemented in the long term. The VisionXC was conceived for exactly these customers.An additional advantage is its compactness, combining all of the technological features in the smallest space. The VisionXC is the ideal convection soldering system for small and medium production batches, in the laboratory or for demo lines. Our local team will gladly advise you!

When condensation reflow soldering with the CondensoX series, the soldering process takes place with the help of hot steam and the medium called Galden. As the heat transfer is up to ten times higher than that of convection soldering, large, massive boards can be processed without any problems. The use of the injection principle and control of temperature and pressure ensures precise and varied reflow profiling. At the SMT in Nuremberg, Rehm will be presenting a space-saving, high-performance system for laboratory applications, small batch production, or prototyping. Void free soldering can be implemented in all systems of the CondensoX series with the vacuum option without any problems.

Increase the quality and the life of your products with the use of protective coatings. Our Protecto system for selective conformal coating applications protects sensitive electronic components against damage caused by corrosion and other aggressive environmental influences such as moisture, chemicals and dust. The coating system achieves complicated application processes in a single step. The use of up to four nozzles gives you enormously flexible coating options.Reinforce your team for even better results! At the SMT in Nuremberg we will also present our new RDS UV, a compact UV dryer that can be integrated into any production environment. Depending on the material requirements, the UV curing system is available with medium-pressure mercury lamps or UV-LED lamps and ensures reliable drying of all UV-cured coatings.

Modern electronics are now used in many industries. Electronic components have to function 100% reliably under all temperature conditions.To analyse the stability of electronics under extreme temperatures, Rehm has developed a completely new series: Securo Minus for cold function tests, or Securo Plus for hot function tests.At the fair we will present Securo Minus for reliable cold function tests.To check, for example, the winter performance of sensitive electronics,the components in the system can be fed with cold air or nitrogen at temperatures down to -55°C. The Securo systems can be optimally combined with other measurement equipment.

As part of the HotAL research project (high temperature-optimised AL-bond technique for offshore applications), Rehm Thermal Systems has developed a system with inert gas operation for tempering power modules in magazines. The system allows temperatures can reach up to 300°C. Lock systems at the inlet and outlet guarantees very low residual oxygen levels of 30ppm O₂. Through the magazine dryer, magazines with the maximum dimensions of 460x260x260mm can be conveyed by a three-part transport. The cycle time can be controlled from a minimum of 3 minutes up to a maximum of 24 hours.

The HotAL research project was funded by the BMBF (German Federal Ministry for Education and Research) and conducted under the project coordination of the Fraunhofer IZM in Berlin (Fraunhofer Institute for Reliability and Microintegration) and the industrial partners Heraeus, SEMIKRON, F & K Delvotec Bondtechnik and Rehm. The magazine dryer is suitable for use in the thermal treatment of semiconductor applications, hybrid constructions and electronic components that must be transported in magazines.