KYZEN to exhibit at IMAPS 2024

At the event, KYZEN’s team will present their multi-process power module cleaner, MICRONOX MX2123.

As the demand for high-performance advanced packaging devices continues to grow, KYZEN offers solutions such as MICRONOX MX2123, along with process optimisation services, to address the challenges faced by manufacturers.

MICRONOX MX2123 is a well-balanced, multi-phase cleaning chemistry developed to remove flux residues from various IGBT module devices, which use copper, silver, and nickel DBC substrates. It is also capable of cleaning flux from PCBs and removing slight metal oxidation from base metals after wire bonding and potting processes, leaving an exceptional surface finish. MICRONOX MX2123 is effective at low temperatures and in low concentrations, and is compatible with both in-line SIA and Ultrasonic Immersion cleaning systems, making it versatile and easy to monitor.

The International Symposium on Microelectronics is an annual event that gathers industry professionals and students for four days of technical programming and professional development in the fields of microelectronics and advanced packaging.