IoT sensor line up primed for Nuremberg outing

RUTRONIK SMART bundles selected sensors, wireless components, microcontrollers, power management and safety solutions as well as software and services for devices and applications within the Internet of Things (IoT). At Sensor+Test, the focus is on sensors for medical and automotive applications, mobile uses and wearables.

A highlight will be the TLV493D-A1B6 3D magnetic sensor from Infineon. With its accurate, ultra-low power 3D measurement including temperature recording, it is suitable for consumer and industrial applications such as joysticks, e-meters and home appliances. The distributor will be exhibiting several focus products specially intended for automotive applications: The high-voltage and high-performance AH376xQ Hall-effect latch family from Diodes with AEC-Q100 qualification provides eight high-tolerance magnetic operate and release points ranging from 25G to 220G.

With open-drain output, the sensors are ideal for the commutation of brushless DC motors, speed measurement, incremental rotary and linear encoders/position sensors.

The small and sensitive VF360NT, VF360ST and VF460S latching digital Hall-effect sensor ICs from Honeywell, also with AEC-Q100 qualification, deliver a clear output signal and shorter latch reaction times than comparable sensor ICs.

The HAR 37xy and HAL 37xy sensors from Micronas meet the high EMC needs of the automotive industry and offer extremely high ESD protection. Both models come in the same SOIC-8 housing with identical sensitive X/Y position for single and dual-die sensors, so that they can be used in the same magnetic circuit.  

In the field of pressure sensors, the focus is on the ABP series of piezoresistive silicon pressure sensors from Honeywell. The simple and cost-effective repeaterless solution with mV output offers elevated quality and high resolutions for medical and industrial applications.

Rutronik will be presenting the SDP3x differential pressure sensors from Sensirion. They measure the differential pressure or air flow in the bypass with maximum precision, repeatability and long-term stability.

This is achieved using the CMOSens technology which combines the sensor element and the digital signal processing on a CMOS chip. Also on parade is the DPS310 from Infineon, a small digital air pressure and temperature sensor with a high degree of precision and low power consumption.

Its sensor element for the air pressure is based on the capacitive principle, thus guaranteeing a high degree of precision during temperature fluctuations.

Thanks to the small housing (2x2.5x1 mm), it is suitable for mobile applications and wearables.

Optical sensors will supplyan innovation in the shape of the current VL53L0 time-of-flight proximity sensor from STMicroelectronics.

With energy-efficient, miniaturized FlightSensesensors, it facilitates rapid autofocus functions with innovative performance for smartphone cameras, proximity sensors as well as object detection in robots and IoT devices.

The IR MEMS thermopile array sensors offer new opportunities for temperature-based detection: The MLX90621 from Melexis is a cost-effective sensor with 16x4 pixel array and a large field of vision of up to 120°x30° horizontal and vertical.

The first surface-mountable thermopile array sensor with 8x8 pixel array and a compact SMD design is the Grid-EYE from Panasonic.

Rutronik will be presenting the HVC-P facial recognition technology from Omron. Using ten sensor functions, it identifies different faces, estimates their gender and age, their attitude, direction of vision and assigns facial expressions to different emotions.

The NJR4265R series from NJRC comprises intelligent motion sensors for the detection of slowly moving objects over short distances, certified for all EU regions.

The sensor board for gesture recognition from Vishay comprises the VCNL4020 proximity and ambient light sensor and two infrared diodes. It facilitates gesture control with swiping left and right, proximity and tapping.  

At the forefront of the MEMS sensors will be the BNO055 from Bosch Sensortec. As a system-in-package (SiP), it combines in one housing an acceleration sensor, a yaw rate sensor and a geomagnetic sensor as well as a 32-bit microcontroller, on which the FusionLib BSX3.0 software runs. This enables simpler system integration, less development time and lower costs as well as shorter product introduction times.

Rutronik will be exhibiting the X-NUCLEO-IKS01A1 evaluation board system from STMicroelectronics. This board combines the LSM6DS0TR (3-axis acceleration and 3-axis gyro sensor) with the HTS221 humidity sensor, the LPS25HB pressure sensor as well as the LIS3MDL 3-axis magnetic sensor. 

Rutronik sensor specialists will be on hand at the exhibition to advise visitors. A wireless expert will be available for advice on the best wireless solutions to suit smart applications, and a Rutronik24 employee will demonstrate how simple and easy it is to place an order or request samples via the Rutronik24 e-commerce platform.