Intel CEO Pat Gelsinger to deliver keynote at COMPUTEX 2024
TAITRA (Taiwan External Trade Development Council) has announced Pat Gelsinger, CEO of Intel Corporation, as a keynote speaker at COMPUTEX 2024 on June 4.
Embracing COMPUTEX’s theme of artificial intelligence (AI), Gelsinger will showcase Intel's next-generation data centre and client computing products bringing AI Everywhere by making the technology accessible through exceptionally engineered platforms, secure solutions, and open ecosystems support.
Gelsinger will detail how Intel’s AI portfolio – including AI-accelerated Intel Xeon, Intel Gaudi and Intel Core Ultra processor families – unlocks new possibilities in the data centre and cloud and across the world’s network and Edge applications, and how it ushers in the age of the AI PC, transforming the future of productivity and creativity. Gelsinger will also discuss how Intel Xeon processors deliver exceptional performance-per-watt efficiencies, freeing up server capacity for more AI tasks while delivering optimal total cost of ownership (TCO) and power-saving sustainability benefits.
AI innovation is expected to increase the digital economy’s impact to as much as one-third of global gross domestic product. With its footprint across data centre, cloud, network, PC and edge, Intel is positioned to support and supply AI across markets and to develop the technologies and solutions that empower customers to seamlessly integrate and effectively run AI across all their applications.
During the COMPUTEX exhibition, TAITRA will host a series of keynote speeches, inviting global technology industry giants to analyse key technological innovations. In addition, more keynote speakers from AMD, Qualcomm, MediaTek, NXP, Supermicro, and Delta, will also take the stage to share their visions for the future of the AI ecosystem collectively.
COMPUTEX is set to take place from June 4 to June 7 at Nangang Exhibition Centre Halls 1 and 2. This year's theme, "Connecting AI," covers six major topics: AI computing, advanced connectivity, future mobility, immersive reality, sustainability, and innovations.