Industry 4.0 demoes lined up for electronica 2016

18th September 2016

Mick Elliott

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Demonstrations of the latest security, cloud connectivity and power technologies for Industry 4.0 will be showcased by Future Electronics at electronica in Munich (November 8-11). The distributor’s stand will feature pods showing technologies grouped into three themes: Experience Security, Experience Power and Experience the Cloud.

The ‘Experience Security’ pod will show a live demonstration of Future Electronics’ own Secure Wireless Access Control evaluation board (pictured).

This board features triple-pass authentication, using a fingerprint reader, an encrypted NFC tag and a numeric keypad for entering a user’s PIN code.

Visitors will be able to meet specialist Future Electronics engineers who can show how to quickly configure the three security features of the board, and explain the way it passes or rejects attempts to gain access and displays the results on the board’s integrated LCD screen.

Based on an NXP Semiconductors LPC43S57 microcontroller, A70CM secure authentication IC, CLRC66302HN multi-protocol NFC front end and PCA8885 eight-channel capacitive touch/proximity sensor, the board was developed at a Future Electronics System Design Centre.

Security technology engineers from Future Electronics will be able to explain to visitors to Electronica the steps to integrate this kind of security functionality into their product designs.

In addition, the stand will feature a new, low-cost Future Electronics-developed Microsemi Creative Board, which enables evaluation of a low-power FPGA for safety-critical applications.

This board is a flexible system development platform for users of Microsemi’s Igloo 2 and SmartFusion 2 FPGAs, and features connectors for Arduino, MikroBUS and PMOD extension boards.

It enables designers to rapidly implement a complete prototype system around a Microsemi FPGA and develop a proof of concept.

Future Electronics will be making 40 Microsemi Creative Boards available exclusively free to qualified engineers who apply at the Future Electronics’ stand.

The stand’s Experience Power pod will exhibit wireless charging, silicon carbide and Power-over-Ethernet products from ROHM Semiconductor, Microsemi and Semtech, as well as Vicor’s highly efficient two-stage (1.8kW AC in/5V DC out) power supply design.

The Experience Connectivity pod features application development platforms for Wi-Fi, Bluetooth Low Energy and LoRa wireless technologies from STMicroelectronics, Cypress Semiconductor and Microchip.

All will be connected to Future Electronics’ cloud infrastructure to demonstrate ‘chip to cloud’ communication.