IBASE to unveil Edge AI Solutions at embedded world 2024

Mark your calendars for April 9-11, 2024 and stop by IBASE booth 3-351 in hall 3 to see the innovative solutions for your IoT devices.

At the show, we will showcase our latest RM-QCS6490-S SOM module based on Qualcomm QCS6490 processor and RM-QCS610 SMARC 2.1 module based on the Qualcom® QCS610 processor, both supporting a wide-range operating temperature from the lowest -25°C to the highest +80°C for harsh environments. These cutting-edge solutions deliver powerful connections, computing performance, and are designed for industrial IoT applications such as rugged handhelds and tablets, kiosks, POS, and human-machine interface systems.

"Collaborating with IBASE, we are excited to showcase next-generation edge AI solutions powered by Qualcomm Technologies at Embedded World 2024," stated Dev Singh, Vice President, Business Development and Head of Building, Enterprise & Industrial Automation, Qualcomm Technologies. "Our collaboration aims to deliver advanced computing capabilities for industrial IoT applications, enabling businesses to harness the power of AI in rugged environments."

"IBASE has established a long-term collaboration with Qualcomm Technologies, working together to develop more advanced capabilities for customers in the field of Edge AI deployments," said Albert Lee, president of IBASE. "We aim to deliver increasingly sophisticated and efficient AI-focused modules that empower businesses and industries worldwide. Through our ongoing collaboration, we are dedicated to shaping the edge computing landscape and ushering in a new era of possibilities and beyond."