Harwin to showcase innovations at Electronica Shanghai 2024

Offering high reliability and manufactured using advanced, automated processes, these precisely engineered technologies meet the exacting demands of global OEMs developing the latest high-performance systems.

Visitors to the Harwin stand (N4.4759) will have the opportunity to explore the company’s enhanced product portfolio of reliable and high-performance technologies for demanding interconnection applications. The show also offers the first opportunity to see demonstrations of the Flecto series, a recent addition to the company’s BBi family of high-reliability board-to-board connectors.

Designed to withstand misalignment, shock, and vibration, Flecto fine-pitch technology combines high-performance data transmission and support for mixed signal and power with an innovative mechanism that ensures reliable mating of multiple PCB connectors during automated manufacturing processes.

Alongside the latest technologies, Harwin will highlight recent investments that have significantly boosted production capacity and the ability to support rapid growth in key markets such as electric vehicles (EV) and aerospace. Part of Harwin's "Scaling for Growth" initiative, these investments have seen the expansion of cutting-edge manufacturing facilities that reduce lead times and address the growing demand for value-added interconnect solutions that incorporate end-to-end mechanical and electrical protection.

“Electronica Shanghai is the leading trade fair for electronic components, systems, applications and solutions in China,” says Mike Tiong, General Manager for Harwin PTE. “This makes it the perfect platform to showcase our latest technologies, explain how our ongoing strategic investments will benefit customers in the region, and provide face-to-face advice and guidance on addressing visitors’ connector challenges.”