Gold stencil to take centre stage at SMTA International 2014
Exhibiting in Booth #221 at SMTA International 2014, FCT Assembly will demonstrate the NanoSlic Gold stencil and Step and Relief Stencils. Company representatives will also be on hand to answer any questions about FCT’s stencils and its coating technology.
Minimising bridging and reducing underside cleaning, NanoSlic technology improves solder paste transfer efficiencies for small apertures resulting in higher yields and less rework. Easily evaluated, the technology is compatible with current assembly equipment and processes.
The NanoSlic Gold stencil has been developed to address the increasing demands confronting the electronic assembly industry. Based on a proprietary application process, the NanoSlic Gold coating coats both the underside of the stencil and aperture walls. Thermally cured and permanent, the coating is both highly hydrophobic and oleophobic which repels solder paste.
The company's Step and Relief Stencils offer variable stencil thickness in specific areas to accommodate reduced volume (step down) or increased volume (step up). The stencils are suited for or controlling paste deposits on PCBs with both standard and fine-pitch SMT as well as intrusive reflow/paste-in-hole components. Steps are chemically etched into the squeegee side of the foil, yet all apertures are laser cut.
SMTA International 2014 is scheduled to take place between September 30th and October 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
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