FEEU showcases expanded supplier portfolio at embedded world

Underneath the 'accelerating global innovation' slogan, FEEU will inform attendees about its current offering for the following core branches: automotive, industrial, medical and fitness and communications. Products and solutions from the following suppliers will be present:

• Ambiq Micro: Next-gen low power MCU’s and low power RTC’s
• FDK: DC/DC power modules and efficient coils for DC/DC converters
• Fujitsu Semiconductor: FRAM solutions
• Hokuriku: Sensors, modules, piezoelectric transducers, tactile switches, ESD protection and trim potentiometers
• Shinko: Progressive packaging solutions
• Tokyo Electron Device (TED)/Inrevium: FPGA boards, FPGA Mezzanine Cards (FMCs) and Origami FPGA modules
• Transphorm: Gallium Nitride (GaN) power devices

As its central innovation, FEEU will present a new FRAM solution at embedded world. This can resist extreme temperatures from -40 to 125°C. This temperature range ensures the nonvolatile storage technology is suitable for the challenging applications found in the automotive and manufacturing industries.

Furthermore, the consultancy services of FEEU will be a main focus at the exhibition. Axel Tripkewitz, President and Managing Director of Fujitsu Electronics Europe, explains the booth design: “As a value added distribution partner, embedded world is one of the most important specialised fairs for us. On-site we will demonstrate the added value of working with us to both our existing and new customers. Our experts are not only central reference points for a global network of carefully selected components and services, but also important advisors, able to accompany product development from the early planning stage through to the production phase. If a problem occurs during the development process, they use their market experience and their technical know-how to quickly find an appropriate solution. With this approach we guide our clients’ projects swiftly to success.”