Empower showcases IRVs at APEC 2024

Trey Roessig, Empower’s CTO and SVP of engineering will present, ‘In-Package DC/DC Conversion Simplifies and Improves the Performance of Deep Submicron AI/xPU Power Domains,’ on Wednesday, February 28, at 1:55pm PST as part of the industry sessions.

The company will demonstrate the latest additions to its family of IVRs at booth #2044. The ultra-fast EP71xx family of multi-rail, multi-phase regulators delivers upwards of 20W in 35mm2 and eliminates all external components, shrinking board space by 3x, to provide the most compact and highest performance solution in the industry.

Now available on interposers or coupled with off-the-shelf inductors, embedded systems designers have additional choices to further simplify and accelerate the design-in process while raising the bar for efficiency. Combined with its ECAP ultra-low ESL silicon capacitor products, Empower’s power management solutions achieve an unprecedented level of compactness and performance for any space constrained data-intensive applications.

During the industry sessions, Trey Roessig will discuss design challenges of current and next-generation performance AI/xPU products manufactured on the latest FinFET processes, which feature increased package complexity and the proliferation of external voltage converters. Roessig will describe technologies that allow integration of the power conversion inside the product package, simplifying the power delivery network and reducing the power train parasitics, package ball count and printed circuit board space.

"By looking at power delivery as a whole, Empower is able to optimise the power system rather than individual components. Our solutions provide a level of elegance, simplicity and performance that is unmatched,” stated Roessig. “That same technology is now being integrated as a power chiplet into chiplet-based architectures, eliminating multiple external regulators and simplifying the power delivery network.”