congatec discuss new computer-on-modules applications in ‘megatrends’｜embedded world

The new COM-HPC Client computer-on-modules 13th Gen Intel Core processors are designed to be used in landscapes which require ‘outstanding multi-core and multi-thread performance’. 

“So basically our target here is to address specific use cases such as autonomous vehicles, autonomous mobile robots, and also transportation and construction sites,” Marketing VP of congatec Tim Henrichs told the audience. 

The conversation was then passed to a panel of experts, who elaborated on application, utility and the need of more powerful embedded systems. 

“We had some growth last year and are expecting more growth this year and in the coming years and this will be mainly driven by the digital transformation of disruptive technologies like AI, machine learning, Edge computing, and embedded vision,” congatec CTO Konrad Garhammer explained.  

The new computer-on-module has Thunderbolt and enhanced PCIe to support up to Gen5, and the modules based on the new COM-HPC standard open up new horizons for developers in terms of data throughput, I/O bandwidth and performance density. These features make for significant improvements in a wide range of industrial, medical, AI, and machine learning (ML) applications, as well as all types of embedded and Edge computing with workload consolidation. 

These disruptive technologies brought the talk onto what congatec defined as ‘megatrends’ in a ‘High Performance Landscape’: “Megatrends affect all areas of society, economy, and consumption, changing values, the way people live together, the mediums of political system,etc. But how can we help companies to turn the challenge of megatrends into opportunities for new and sustainable solutions? This is why we have defined the high-performance landscape,” Herichs said. 

The portfolio congatec is showcasing ranges from ‘high performance’ COM-HPC server-on-modules to ‘ultra-compact’ and brand-new COM-HPC computer-on-modules roughly the size of a credit card. This aims to providedesigners what they need for their next-generation of high-end embedded and Edge computing platforms. With the new COM-HPC Mini standard, congatec aims for even the most space-constrained solutions to benefit from this high-performance boost and a significantly larger number of new high-speed interfaces. Therefore, congatec state entire product families can now migrate to the new PICMG standard – without requiring significant modification of the internal system design and housing. 

Tuesday’s press briefing will be followed by a presentation of the “COM-HPC Server-on-Modules” on Thursday.