Conference focuses on best practices for cleaning & coating
Scheduled for 18th to 20th November in Illinois, USA, SMTA and IPC have jointly announced the 'High-Reliability Cleaning and Conformal Coating Conference'. The conference will be focused on the best practices and innovative technologies required to meet manufacturing challenges and produce reliable hardware.
Component miniaturisation narrows the distance between conductive paths. Therefore, a test vehicle and methodology is required to quantify the effects of residues under component terminations.
Mark McMeen, VP of Technology, STI Electronics, will be the keynote speaker for the Technical Conference. He will discuss funded research with the U.S. Military & Defense which quantify the effects of flux residues and other contaminants remaining under component terminations.