CEA-Leti announces annual Leti Innovation Days

Leti Innovation Days 2024 will offer more than 1,000 semiconductor industry professionals a close-up look at new microelectronic solutions that will help power, control and enable ultra-sophisticated devices and equipment across the industrial, medical, automotive and consumer markets.

“CEA-Leti is committed to getting new semiconductor technologies from lab to fab swiftly and efficiently,” said CEA-Leti CEO Sébastien Dauvé. “We invest extensively in our pilot lines each year and, as chip production ramps up around the globe, this year presents unprecedented opportunities for CEOs, research & development directors, engineers and visionaries to innovate and deliver.”

Presentations, workshops and discussions will cover many timely and critical topics for the industry, ranging from AI, edge computing, augmented reality and green technologies to health care, telecommunications and optics.

“As always at CEA-Leti, partnerships will be instrumental to helping industry leaders and innovators accelerate their progress from lab to fab with relevant, robust and reliable products for their key markets,” said Michael Tchagaspanian, CEA-Leti EVP strategic partnerships & event chairman.

Keynote speakers

• Stefan Finkbeiner, CEO & GM, Bosch Sensortec
• Laura Matz, CSTO, Merck
• Bernhard Quendt, CTO, Thales Group
• Sanjay Natarajan, SVP & GM, Components Research, Intel
• Lia Li, CEO & Founder, Zero Point Motion
• Fabio Gualandris, President Quality, Manufacturing & Technology, STMicroelectronics
• Jean-Philippe Fricker, Founder & Chief System Architect, Cerebras Systems
• Laith Altimime, President, Semi Europe
• David Anderson, President, NY CREATES
• Sébastien Dauvé, CEO, CEA-Leti
• Theodore Sizer, EVP, Optical Research, Nokia Bell Labs
• Christina Strohrmann, Director Advanced Engineering, Bosch Sensortec
• Coby Hanoch, CEO, Weebit Nano
• Leroy Liu, CSO, Realtek
• Emmanuel Sabonnadière, EVP Division Automotive & Green Industry, Soitec

Conferences

• Electronics & Sustainability
• Tech for Health
• 3D Heterogeneous Integration
• Sense & Act
• New Materials for Computing
• RF & Telecommunications

Partner's corner

Speak with CEA-Leti's partners from the entire semiconductor value chain:

• Aniah
• Electronmec
• Serma Microelectronics
• SET Smart Equipment Technology
• Carnot Institutes network
• EVG
• SCREEN
• MICROTEST
• TECHNIC
• SVCS
• Tektronix
• Soitec
• Teledyne
• PREVAIL
• NplusT
• INFICON
• Murata
• ClassOne
• IC’Alps
• Equans
• Minalogic

Startups’ corner

• ADMIR
• NGSENS
• Direct Analysis
• Quobly
• SCINTIL Photonics
• Injectpower
• SteerLight
• Wise-integration
• eLichens
• Ecylpia
• Arise
• Orioma
• Magellan Program