Bostik marks 40 years of Thermelt at Productronica

The Thermelt hot melt polyamide range from Bostik has evolved to meet the sustainability challenges in modern manufacturing processes. Predominantly made from renewable raw materials, Thermelt offers ease of processability at low pressure and temperatures. It also supports the disassembly of overmoulded products at the end of their lifecycle, leading to reduced waste and enhancing recycling opportunities.

Thermelt, a non-reactive, solvent-free, and bio-based adhesive, is composed of derivatives from rapeseed and castor beans. It finds application across various manufacturing processes, ranging from assembly in the shoe industry to Low Pressure Moulding (LPM) in electronic and automotive component manufacturing. Its use is expanding into new technologies, such as agriculture, electric vehicles, and batteries.

This hot melt, comprising up to 90% bio-based raw materials, enables easy disassembly by heating at a product's end of life. This feature aids manufacturers in achieving circularity and reducing environmental impact while maintaining performance. Bostik customises bonding solutions to meet specific customer needs in terms of strength, viscosity, curing, and other properties.

This bespoke approach benefits from Bostik’s parent company, Arkema, which controls its entire vertical supply chain, from raw material sourcing, such as a castor bean farm in India, to its manufacturing plant in Privas, France.

Polivio Goncalves, Head of Engineering Adhesives at Bostik, stated: “For 40 years, Bostik has been investing heavily in developing this product to meet the changing needs of both assembly and LPM manufacturing. Since the 1980s for instance, the continuing miniaturisation and sophistication of electronics has led to sensors which are a pervasive part of life today, from electric vehicles to solar panels, to smart devices. Bostik has continuously reformulated Thermelt to provide the additional strength and protection these increasingly sensitive components need.”

Sophie Chhun, Head of Assembly Adhesives at Bostik, added: “Bostik is a leader in the field of specialty hot melts and holds the largest market offering to date. Our Thermelt manufacturing site in Privas, France, has been expanded to address market growth and product demand. With the benefit of vertical integration with our parent company, Arkema, customers can rest assured that bio-based products such as Thermelt will continue to innovate and provide new possibilities to provide solutions for modern sustainability challenges.”

Productronica will take place at the Munich Trade Fair Centre, where Bostik will co-exhibit with its partner Werner Wirth in Hall A2, stand 159.