Test solutions centre stage at Intel Developers Forum

The T5833 system is a high-volume, versatile test solution designed for both wafer sort and final test of LPDDR3-DRAMs, high-speed NAND flash, multi-chip packages (MCPs) and non-volatile memory devices – the primary memory ICs used in smart phones and tablet computers. With a parallel test capacity of 2,048 devices for wafer test and 512 devices for final package test, the T5833 lowers costs by significantly reducing test times and boosting throughput.

The cost-efficient T5831 system, already installed for high-volume manufacturing, supports testing of all NAND flash devices, including all ONFI, Toggle, 3D NAND and eMMCs, and mobile DRAMs in MCPs.

Both T5833 and T5831 are built with high-throughput Tester-Per-Site architectures and the semiconductor industry’s highest power supply current per device under test (DUT), making them ideal test solutions for current and next-generation memory devices.

Since both testers are built on Advantest’s modular AS Platform, they enable each customer to choose the optimal system configuration for its specific needs. The platform’s module upgradeability allows it to handle current and future generations of devices, and its scalability increases throughput, all of which generates greater return on investment.

At IDF15, Advantest will exhibit within the DDR4 Memory Community, a collection of suppliers from the memory IC ecosystem that are spearheading the development of the upcoming fourth generation in double data-rate (DDR) memory technology.