Advantest highlights test innovations at ITC 2024

Product Display

This year Advantest will highlight its System Level Test (SLT) platforms that achieve cost-effective structural test coverage (SCAN, MBIST, LBIST, etc.) over functional high-speed IO interface. A demo showing how Advantest Test Solutions (ATS) can integrate a closed loop, fan-controlled, thermal cooling system in an SLT system while successfully maintaining a dynamic junction temperature (TJ) setpoint during the test.

Also on show is the new DC Scale XHC32 power supply for the V93000 EXA Scale, offering 32 channels with an unprecedented total current of up to 640A; and Pin Scale Multilevel Serial, the first native and fully integrated HSIO instrument expanding the EXA Scale platform to address signaling requirements for advanced communication interfaces.

The ACS Real-Time Data Infrastructure (ACS RTDI is an open solutions platform-as-a-service enabling streaming data access and real-time analytics with integrated test software and hardware monitoring and control to improve semiconductor device yield, quality and capacity.

Presentations

In addition to participating in the product showcase, Advantest employees will also present at this year's event.

Rich Lathrop, senior director of business development, will present a corporate overview outlining Advantest’s latest business strategy and mid-to-long-term management plan during the Presentations of Platinum Sponsors session starting at 4 p.m. on Nov. 5.

Ira Leventhal and Keith Schaub will also present “AI Chip Testing: Transforming Challenges into Opportunities with AI/ML/LLM Technology” during the poster show starting at 12:00 p.m. on Nov. 6.

Additionally, Sing Hee Wong, deputy director of advanced packaging and test, TSMC, will present “Evolution of Semiconductor Testing with AI” during Session A1: ML in Test (AI Track) on Nov. 5, illustrating how TSMC creates an AI ecosystem for semiconductor testing leveraging Advantest Cloud Solutions (ACS).