Toshiba Announces Camera And Display Bridge Chips For Mobile Devices

These products provide high-speed serial interfaces between a mobile phone’s baseband or application processor and the phone’s display or integrated camera and are a requirement for high-resolution displays and cameras used in smartphones, mobile internet devices, netbooks, smartbooks and other high-performance mobile devices. They are the latest additions to Toshiba´s Embedded Mobile Peripheral SoC line up.

Smartphones and other mobile devices have become increasingly feature rich, supporting functions like high-definition video, 3D graphics, high-resolution still image and video capture and even video conferencing. With their support of high-speed MIPI and MDDI interfaces, Toshiba’s new bridge chips will allow customers to design mobile devices that can easily handle high-bandwidth communication between the phone’s display, camera and baseband or application processor, giving consumers an uncompromised video experience.

The TC358740XBG camera bridge chip provides connectivity for MIPI cameras to baseband or application processors using an MDDI interface. The bridge chip supports MDDI 1.2 Type 2 on the Host side. The device offers support for up to two cameras, with the primary camera using a MIPI link and the secondary camera using a MIPI link or parallel port. The bridge enables high-speed serial interfaces on both the Host via MDDI and camera side via MIPI CSI-2 allowing support for up to 12 megapixel primary camera and up to 2 megapixel secondary camera in one handset. It is compatible with systems using Qualcomm® baseband processors with an MDDI interface.

The Toshiba TC358760XBG and TC358761XBG display bridges are optimized for mobile handsets using an MDDI high-speed serial digital packet host interface and provide connectivity of MIPI display panels to baseband or application processors using an MDDI interface. They are based on the MDDI 1.2 Type 1 and MIPI DSI 1.01 interfaces, but are backward compatible with MDDI 1.1. They support direct refresh through the MDDI link. In addition, the TC358761XBG offers support for legacy parallel interfaces such as a MIPI DPI and an MIPI DBI on the host side or the panel side, allowing re-use or extended use of existing design and components. These devices are compatible with systems using Qualcomm® baseband processors with an MDDI interface.