SIP eases path from prototype to production

2nd February 2017

Mick Elliott

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Datasheet

The OSD3358 system-in-package (SiP) from Octavo Systems is now in stock at Mouser Electronics. The SiP device makes it easier for designers to quickly create production-ready systems based on the Texas Instruments (TI) Sitara AM3358 processor with an ARM Cortex-A8 core. The device is geared to help developers who are using the BeagleBone Black Wireless single board computing platform (or any design based on Sitara processors) move from prototype to production effortlessly.

The device integrates the core of the BeagleBone Black — the AM3358 processor, the TI TPS65217C power management IC (PMIC), the TI TL5209 low dropout (LDO) voltage regulator, 512MBytes of DDR3 SDRAM, and over 140 passive components — into a single BGA package.

Through this integration, the OSD3358 removes the complexities of power sequencing and DDR-to-processor interfacing that are typical in the design process.

At the same time, the single package simplifies the supply chain and facilitates lower-cost manufacturing.

Developers can prototype software on the BeagleBone Black Wireless and then seamlessly transition it to custom boards that include the OSD3358 SiP without loss of performance.