Design
Silicon Labs To Showcase Smart Interface, Smart Home And Smart Energy Solutions At Embedded World
Addressing the embedded market demand for smart interface and connectivity solutions, Silicon Laboratories Inc. (NASDAQ: SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, will highlight its latest semiconductor innovations at Embedded World 2011 in Nuremburg, Germany, Mar. 1-3 at Stand 12-136.
SiliSilicon Labs will offer an array of hands-on demonstrations of its mixed-signal solutions:
• Discover the ease-of-use and versatility of Silicon Labs’ plug-and-play “HID-USB-to-IR” human interface reference design, which demonstrates advanced multi-dimensional touchless control through simple, pre-defined gestures, supported infrared proximity sensors and HID-USB connectivity.
• Simplify your human interface applications with Silicon Labs’ developer-friendly QuickSense Studio. Leverage this easy-to-use yet powerful development environment to create buttons, sliders and other HI elements for advanced touch-sense and touchless human interfaces.
• Connect with the future of scalable, small-footprint wireless mesh networks based on Silicon Labs’ Si10xx wireless MCUs providing an ultra-low-power solution for smart metering, building automation, home security, commercial lighting control, asset tracking systems and other wireless networking applications. See how easy it is to add Wireless M-BUS or KNX to your smart metering and automation solutions.
• Learn how to add USB and HID-USB support to your next application or upgrade legacy serial applications with USB connectivity – without the cost and complexity of driver installation or software development.
• See the industry’s easiest-to-implement wireless remote control solution, the Si4010 RF transmitter SoC, providing a highly integrated, cost-effective solution for remote keyless entry (RKE) and remote controls for home automation and wireless security systems.
• Design next-generation energy-harvesting applications with Silicon Labs’ wireless MCUs, ultra-low-power MCUs, and sub-GHz ISM band transmitters, receivers and transceivers. Using thin-film battery technology, our reference design simplifies the development of energy-harvesting systems that tap into solar, thermal, piezo and RF energy sources.