RF IPD kit supports IoT, 5G component design

These components are realised by using low-insertion loss matching networks and RF filters with a small footprint (less than two millimeters by two millimeters) and high-current handling.

Implemented in the PDK are electrical models and parameterised layout cells (PCells) that work with the 3DGS parameterised extraction flow for AXIEM 3D planar and Analyst 3D finite element method (FEM) electromagnetic (EM) simulators within Microwave Office circuit design software.

The PDK also supports NI AWR software iNet intelligent and automated net routing technology, design-rule checking (DRC) and connectivity check/highlight.

“Chip-to-board and chip-to-chip interconnects are a common cause of unwanted parasitic losses in lumped-element devices,” said Jeb Flemming, 3GS CTO. “IPD technology significantly reduces these losses by embedding capacitors, inductors, filters, baluns and combiners into a single monolithic microwave integrated circuit (MMIC), providing electronic devices with a reduced footprint, reduced energy consumption and improved RF performance.Our advanced 3D routing of RF signals on top, through and on the bottom of the glass IPD improve performance by distancing RF components and minimising unwanted parasitic losses.”

“Our collaboration with 3DGS to develop the IPD PDK for the NI AWR Design Environment platform continues our commitment to deliver solutions that enhance the microwave design process,” said Sherry Hess, vice president of marketing at AWR Group, NI. “The 3DGS PDK allows customers to explore product development on glass for smaller and more energy-efficient products.”