Reference kits designed for contactless payments

To optimise RF performance, the OM5597/RD2612 integrates an antenna amplifier. Allowing designers to explore the potential for NFC-based payment applications, the design kit features the company’s near field communication PN512 front-end device. Utilising NXP’s CLRC663 NFC reader solution, the OM5597/RD2663 achieves EMV Level 1 RF compliance without requiring an additional booster.

Competitiveness in the POS market is increased by a faster design cycle, which ultimately reduces the time it takes to replace legacy payment terminals. According to ABI Research, between 2013 and 2016, shipments of POS terminals are forecast to grow from 13.8m units to 15.6m units. ABI Research also expects shipments of mPOS terminals to reach 51m units by 2019. The OM5597 designs kits are offered with embedded NFC functionality, allowing them to be used as training tools for designers entering the mPOS market.

“The key to a successful roll-out of secure contactless payments in the remaining markets depends on the speed at which businesses, large or small, can access the latest technology. Our OM5597 design kits with EMV Level 1 certified software components will help designers that are not so familiar with payment technologies get a head start in their development cycle,” said Rutger Vrijen, Vice President and Head of Strategy, Business Unit Identification, NXP Semiconductors. “The inclusion of NFC in the design kits will bring greater flexibility to terminals by offering, for example, peer-to-peer data exchange, loyalty tracking or targeted marketing. It also opens opportunities in new markets or application areas such as consumer electronics, home appliances, automotive and computing.”