Low-temperature lead-free solder paste for high-speed printing
SHENMAO America, Inc. has released its PF735-PQ10-10L low melting point lead-free solder paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.
The demand for ultra-thin packages continues to increase. This reduction in package thickness has led to an increase in warpage, resulting in production yield loss.
PF735-PQ10-10L offers some important benefits when it comes to SMT assembly. The low-temperature solder paste can reduce the reflow temperature to below 190°C compared to lead-free soldering, which is typically 240°-250°C. When compared with SnAgCu, the PQ10 series of low-temperature solder paste reduces peak reflow temperature, energy consumption, and warpage of PCBs and components.
In comparison with the Sn42/Bi58 Eutectic alloy, the PQ10 series offers better ductility, finer microstructure, and increased drop and thermal reliability. PF735-PQ10-10L is suitable for precise electronic products, such as laptops, PCs, servers, and LED modules. Furthermore, it has been successfully mass produced on laptops.
PF735-PQ10-10L is Halogen-free (ROL0) with no halogen intentionally added. It complies with RoHS, RoHS 2.0, and REACH.
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