Atrenta and TSMC Announce SpyGlass IP Kit 2.0 Availability

IP Kit 2.0 has undergone extensive beta testing by TSMC soft IP alliance partners: Digital Media Professionals Inc., Dolphin Integration, Sonics, Inc. and Vivante Corporation. IP Kit 2.0 will be fully supported on TSMC-Online and available to all TSMC’s soft IP alliance partners on Nov. 20, 2012.

Originally announced on May 26, 2011, TSMC’s soft IP quality assessment program is a joint effort between TSMC and Atrenta to deploy a series of SpyGlass checks that create detailed reports of the completeness and robustness of soft IP. Currently, over 15 soft IP suppliers have been qualified through the program. IP Kit 2.0 represents an enhanced set of checks that adds physical implementation data (e.g., area, timing and congestion) and advanced formal lint checks (e.g., X-assignment, dead code detection). IP Kit 2.0 also allows easier integration into the end user’s design flow and enhanced IP packaging options.

“The predictability of soft IP reuse continues to be a challenge for the SoC design community,” said Mike Gianfagna, vice president of corporate marketing at Atrenta. “Thanks to TSMC’s commitment to drive the quality of soft IP deliverables, we are making real progress toward improving soft IP reuse.”

“ The soft IP9000 program has already had a positive impact on the delivered quality of soft IP for TSMC’s customers. The addition of physical implementation information and formal lint analysis will further enhance the effectiveness of the program,” said Suk Lee, senior director, Design Infrastructure Marketing Division at TSMC. “The beta test program went very smoothly. IP Kit 2.0 installed easily and ran with minimal issues during the beta test period for our selected soft IP alliance partners.”