FD-SOI heterogeneous design becomes a reality for the IoT

12th March 2015

CEA / Leti

Jordan Mulcare

0 0

CEA-Leti today announced the launch of its Silicon Impulse IC design competence centre, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer shuttles. Established to increase the competitiveness of Leti’s industrial partners, the centre provides immediate access to Leti’s and CEA-List’s advanced IC technologies and systems expertise. The platform also leverages Leti’s extensive experience in technology transfer.

Collaboration between Leti and List experts and ecosystem partners aims to shorten time-to-market from idea to production. This process includes prototyping and pre-production runs utilising Leti’s advanced industrial infrastructure from concept to production hand-off.

Silicon Impulse offers its partners the full range of Leti and List’s expertise in analogue, RF, digital and memory design and hardware/software-integrated solutions at the technology node that most cost-effectively meets their needs. The IC competence centre combines Leti’s large portfolio of technologies and low-power design solutions with a unique service for speeding integration of FD-SOI, ReRAM, MEMS, 3DVLSI, and silicon photonics, enabling heterogeneous low-power co-integration.These services are targeted to enable the rapidly emerging 3rd gen information-acquisition and processing devices that are key to the IoT.

“Pervasive wireless networking and groundbreaking low-power technologies are critical to the widespread adoption of the IoT, because they improve the performance of portable devices and their network infrastructure,” said Marie-Noëlle Semeria, CEO, Leti. “With Silicon Impulse’s one-stop-shop platform, 28nm FD-SOI heterogeneous, low-power design becomes a reality for the IoT community. Silicon Impulse helps Leti’s partners introduce innovative products that deliver optimal performance for these applications, and benefit from the most advanced technologies.”

Specific features of the offer include:

Leti’s pool of expertise in advanced IC design and low-power technologies;
leading-edge IC technologies for application-oriented device, circuit and system solutions;
regularly scheduled MPW shuttles for silicon prototyping and small-volume runs;
an established high-tech supply chain to accelerate production ramp-up and hand-off;
customised collaboration to fit partner needs.