Design
Cadence's Encounter RTL Compiler adopted by Renesas Micro Systems
Cadence Design Systems announced today that Renesas Micro Systems has adopted the Cadence Encounter RTL Compiler for synthesis, highlighting a utilization improvement of 15 percent, area reduction of 8.4 percent, quick turnaround time, and cost reduction for complex ASIC designs.
“RIn today’s ASIC design development, there is an increased demand for ultra large-scale, high speed, and complex designs, and Renesas Micro Systems is focused on high-density layout, high speed, and short turnaround time for its ASIC designs. In the past, it was difficult for company engineers to fix serious routability issues after running place and route tools, resulting in longer turnaround times; if engineers identified hot spots, they were forced to run place and route tools to assist with maximum utilization, adjustment of placement congestion, floorplanning and circuit optimization.
Encounter RTL Compiler is unique in that it enables an environment for the structural analysis of a netlist early in the flow. This allows Renesas Micro Systems engineers to identify problematic structures in their designs before conducting place and route. By applying this methodology, they have been reducing turnaround time and easing congestion hot spots, which allows them to further improve utilization and reduce the die size.
In several ASICs—down to 28 nanometers--that have been manufactured, Renesas Micro Systems has reported overall utilization improved by as much as 15 percent over results from the company’s prior methodology. By leveraging Encounter RTL Compiler, Renesas Micro Systems successfully completed several complex ASIC designs in a shorter period of time with reduced die size.
“Like many other technology companies, Renesas Micro Systems is seeking an edge in time-to-market and cost,” said Dr. Chi-Ping Hsu, senior vice president of research and development, Silicon Realization Group, at Cadence. “As a key technology in the Cadence RTL-to-signoff flow, RTL Compiler offers unique capabilities that can get products to market faster while meeting today’s aggressive die size requirements.”