EDA products make US debut at DAC show in Austin

Fraunhofer IIS/EAS products include tools and services related to the first SystemC/SystemC AMS design environment for comprehensive hardware/software co-design, one of the most advanced analogue design flows available as well as reliability and thermal analysis tools.

In addition, Fraunhofer IIS/EAS design services for 3D packaging and services for the automotive electronic product development is now available to North American IC designers, system architects, quality and reliability engineers who are responsible for the solution of complex design problems.

The Fraunhofer institute will provide first line technical support and products available from EDATechForce include System Level Design Services, Degradation Analysis, and HeatVision, a software tool for the quick analysis of mixed signal designs in order to have the complete control of a design's thermal conditions.

Also on offer are Intelligent IP – IIP, a new analogue IP generator which has been used internally at Fraunhofer for many years and Wireless Communication in Critical Environments which enables analysis of radio wave propagation and optimisation of wireless node locations for applications like clean rooms and process chambers.

“As one of Europe’s leading applied research institutions in the field of design automation, we are looking back on more than 20 years of successful cooperation with the semiconductor industry. The next logical step is to offer our advanced solutions not only to European enterprises but also in the main EDA market – North America,” points out Dr. Peter Schneider, division director of Fraunhofer IIS/EAS. “We are convinced that the agreement with our highly experienced new partner EDATechForce is the ideal way to allow our American customers to profit from our solutions and expertise.”

“We have spent years searching for new technologies and an extraordinarily experienced partner like Fraunhofer IIS/EAS. Fraunhofer IIS/EAS will help us meet the demands of our growing list of North American advanced chip and system design customers,” says EDATechForce President and CEO, Carl DeSalvo. “With years of hands-on design experience, a robust suite of new in-demand design tools and IP, the EAS division is the ‘best of the best’ – the ideal partner to help our customers bring even their most complex designs to market quickly –  with the highest levels of reliability.”

Together Fraunhofer IIS/EAS and EDATechForce will present a selection of these products during the 53^rd Design Automation Conference taking place in Austin, Texas (June 6-8).