Design flow features a virtual die model concept

In support of early marketing-level studies for a proposed new device, users can now plan, assemble and optimise complex systems with minimal source data. The solution allows design teams to realise faster and more efficient physical path finding and seamless tool integration for rapid prototyping, right to the production flow.

The design flow solution ensures that ICs, packages and PCBs are optimised with each other to reduce package substrate and PCB costs by efficient layer reduction, optimised interconnect paths and streamlined control of the design process. The Xpedition Package Integrator product also provides the industry’s first formal flow for BGA ball-map planning and optimisation based on an ‘intelligent pin’ concept, defined by user rules. In addition, a multi-mode connectivity management system provides cross-domain pin-mapping and system level cross-domain logical verification.

The design flow leverages other Mentor Graphics tools such as the HyperLynx signal and power integrity product, FloTHERM CFD thermal modelling tools and the Valor NPI substrate fabrication checking tool. To complete the Mentor Graphics co-design solution, Nimbic was acquired in 2014. The Nimbic technology provides Maxwell-accurate, 3D full-wave EM high-performance simulation solutions that accurately calculate complex EM fields for chip-package-board simulation.

“Companies are recognising that it will not be possible to design optimal systems in a timely fashion without the ability to co-design the IC, package and board,” said E. Jan Vardaman, President and Founder, TechSearch International. “Incorporating key parameters from thermal and EM modelling will be critical in meeting performance objectives. Automating this process is essential to meet development and product launch schedules in our fast moving market segments. Mentor’s Xpedition Package Integrator tool is a breakthrough in the design process.”

“The Xpedition Package Integrator design flow, especially the unique virtual die model, gives package and board design experts really meaningful guidance and tools for their parts of the system design efforts,” commented Herb Reiter, President of eda2asic and Director of 3D-IC Programs, Si2. “This flow also allows quick and structured feedback to the IC designers and enables true die-package-board co-design and optimisation towards best possible performance versus power ratios for your next system design.”

“Mentor Graphics recognises the increasing complexity in electrical systems design and manufacturing, particularly for IC, package and board co-design,” said A.J. Incorvaia, Vice President and General Manager, Systems Design Division, Mentor Graphics. “Our Xpedition Package Integrator flow will enable systems designers to achieve optimum productivity by saving time and costs while improving the overall quality and performance of advanced systems.”

The Xpedition Package Integrator flow is available now.