Chiplets are rising: where and when?

The programme for the Summit, which focuses on the latest developments in chiplet technology, is now available online.

Chiplets are revolutionising the semiconductor industry by enhancing chip yields and reducing costs, while still delivering the performance of large monolithic chips. They allow designers to mix and match different chiplets, select the most suitable process technologies for specific functions, utilise chiplet IP, and transition to new process nodes more efficiently. This avoids wafer waste and manufacturing defects. Chiplets are crucial in creating high-density, high-performance chips needed for contemporary applications in networking, storage, AI/ML, analytics, media processing, HPC, and virtual reality.

The Chiplet Summit 2024 offers a comprehensive exploration of the latest chiplet architectures, development platforms, and applications. The event will feature pre-conference seminars, keynotes, annual updates, and a variety of paper and panel sessions. These sessions will delve into every aspect of chiplet development, including design, interconnect, packaging, integration, and testing.

At the Summit, Yole Group's Principal Analyst for Computing, Tom Hackenberg, along with Computing's Technology & Cost Analyst, Ying-Wu Liu, will present a ‘Market Research Update’ during the opening plenary session titled ‘Chiplet Markets Are Rising: Where and When?’

Additionally, Tom Hackenberg will lead an expert panel on market research in the closing session. This panel, which will discuss ‘Chiplets in 2028 and How We Got There’, aims to shed light on future market trends. The panel discussion, moderated by Bill Wong, Technology Editor for Electronic Design, will feature insights from John Shalf of Lawrence Berkeley Laboratory, Bapi Vinnakota from the Open Compute Project, and Jawad Nasrullah from Palo Alto Electron. Hackenberg will also deliver a keynote for the Open Compute Platform Track.

“According to Yole Intelligence’s Processor Market Monitor, heterogeneous processing has enabled an enormous smartphone application processor market hovering just below $40 billion. But like Moore’s Law, this heterogeneous processor technology trend is running into physical barriers. Growing die size and complexity creates yield and design challenges of its own. To address this problem, the semiconductor industry is turning to chiplet-based manufacturing. Join us at the Chiplet Summit to discuss which markets are already developing heterogeneous processing on chiplet-based manufacturing even earlier than smartphones,” said Tom Hackenberg from Yole Group.

“From our technical analysis of consumer products, advanced automotive system-on-chips, and the processors for high-performance computing (HPC) applications, we see the chiplet concept has been introduced mainly in the field of HPC. All the chip giants, such as Apple, AMD, NVIDIA, and Intel, have been developing their chiplet-based processors using advanced packaging technology. In addition, we also see some heterogeneous ASICs made by Chinese server manufacturers. During our presentation at Chiplet Summit 2024, we will present several examples available in the market for a better understanding of chiplet-based technology. Join us!” said Ying-Wu Liu from Yole Group.