Rehm Thermal Systems Announces Three Next-generation Soldering Solutions

##IMAGE_1_R##The use of different gases as well as formic acid and microwave plasma is supported. All of the models offer a small footprint, and all are low cost to rapidly turn increased productivity into profitability.

Vacuum Soldering delivers a huge array of exceptional productivity and quality advantages by dramatically reducing voids in solder joints, crucial in the production of power electronics. It also supports processes such as plasma cleaning and gas exchange for advanced packaging through the controlled use of gases during the soft-soldering process at temperatures up to 450 degrees Celsius.

It facilitates oxide-free and void-free connection of the chip to its substrate and allows flux free soldering and the use of solder preforms. Degassing and drying can be integrated into a single process. Vacuum Soldering delivers significantly increased yields through oxide-free processing and improving wetting to enhance solder filling.