Single-part thermal compound gel

Typical applications include automotive ECUs (electronic control units), power supplies, semiconductors, memory modules, power modules, microprocessors/graphics processors, flat panel displays and consumer electronics.

Unique thermal gel materials from Parker Chomerics result in much lower mechanical stress on delicate components than even the softest gap-filling pads. They are ideal for filling variable gaps between multiple components and a common heatsink. Specifically, THERM-A-GAP GEL45 requires no mixing or curing, providing superior design flexibility. Benefits include low thermal impedance when applied to thin and thick gaps, allowing the use of common heat spreaders. In addition, these advanced products deflect easily under very low compressive forces, decreasing component stress and reducing failures.

The product is easy to dispense for compatibility with automated processes, offers a high tack surface and is reworkable. Furthermore, it can accommodate a variety of bond line thicknesses (0.089mm minimum) for successful application to multiple devices. 

Parker Chomerics’ thermal gels are silicone-based formulations loaded with conductive fillers and cross-linked to form low-modulus paste. They are highly conformable and provide low thermal impedance, and overcome the pump-out and dry-out issues associated with alternative solutions such as greases.