Component Management

Latest trends in PCB technologies

31st August 2016
Peter Smith
0

AT&S Americas is staging its Tech Days on September 12-13 in Santa Clara, California. During the first day, technical seminars and presentations from AT&S and partners will highlight the latest innovations and market trends for PCB technology. The event will take place at the Santa Clara convention centre. 

On the second day AT&S offers individualized company forums with its experts at the Santa Clara Hyatt Regency Hotel. Hosted by Scott Clifford, President AT&S Americas, the presentations will start with an overview of the technology drivers impacting the next generation of PCB technology.

Hannes Voraberger, Group Manager AT&S R&D will describe how PCB and substrate technologies will merge providing continued miniaturization. This technology oriented presentation will be followed by an industry outlook analyzing the key market trends driving interconnect technology, given by Prismark Partners, an electronics industry consulting firm. A customer perspective explaining the 3D system supply chain integration will be presented by the UTAC Group.

Other speakers will address the design for embedded technology with focus on thinner formats and higher integration as well as mobile design considerations like performance, density, cycle time and material. In addition, PCB flex & rigid technologies and applications, power electronics and thermal management options, mechanical integration and 3D technologies, high-speed and high-frequency in PCB manufacturing are being addressed by the experts.

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