Kyzen to Show the New Stencil Cleaning Line at SMTA Ohio

AQUANOX^® A8820 effectively removes common solder pastes and fluxes, and demonstrates a favorable compatibility profile with stencil cleaning systems. It works well with spray-in-air and select ultrasonic cleaning machines, and is also effective on uncured adhesives. Additionally, the no-foaming property of A8820 is compatible with all materials commonly used in electronic assembly manufacturing and cleaning processes.

AQUANOX^® A8830 is an ultra-low VOC, environmentally progressive formulation that does not damage stencils and is highly effective at removing all types of solder pastes (water soluble, rosin, and no-clean) from fine-pitch apertures. A8830 is a low odor cleaner than can be used in open systems. The green environmental properties of A8830 make it an ideal option for areas where air emissions are highly regulated.

CYBERSOLV^® C8882 is a fast-acting stencil cleaning solvent designed for the under-stencil on printer wipe cleaning process. C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes. C8882 dries quickly, eliminating the streaking and smearing experienced with traditional cleaning solvents.

All three stencil cleaning products were designed from the ground up to meet the tough challenges of cleaning no-clean, lead-free residue from small, 01005 apertures while being compatible with modern nano-coatings as well as with all the modern offline cleaning equipment currently used in the industry. Providing increased performance adds real value with better prints and modern, green technology that is better for the environment. In addition to rinsing great, these cleaners save money and provide excellent cost of ownership.

AQUANOX^® A8820 AQUANOX^® A8830 and CYBERSOLV^® C8882 are available in one, five and 55 gallon containers. CYBERSOLV^® C8882 also is available in 16 ounce spray bottle containers and pre-saturated wipes.