Kyzen to present at the Contamination, Cleaning & Coating Conference

Today, more than 50 percent of components placed onto the board assembly are bottom terminated. The number of connections, component pitch, standoff gap, flux composition and volume of solder reflowed under the bottom termination can impact reliability. These concerns will be addressed during Session 1 of the Contamination, Cleaning & Coating Conference.

As electronic devices build in more features using smaller form factors, there will be limitations, obstacles and challenges to overcome. Advances in component technology can create other issues that may have time delayed effects. One such effect is device failure due to soldering residues trapped under bottom terminated components. If the residues trapped under the component termination are active and can be mobilized with monolayers of moisture, there is the potential for ion mobilization causing current leakage.

Attendees will learn about the risk of residues left under fine-pitch leadless components and the importance of cleaning these residues. Additionally, test methods for localized testing and cleaning process performance measurements will be discussed.