Kyzen demo cleaning solutions at SEMICON Taiwan
Scheduled from 3rd to 5th September 2014 in Taipei City, Taiwan, Kyzen will exhibit in booth 1226 at SEMICON Taiwan. The company will demonstrate the MICRONOX MX2302 wafer-level cleaning solution and the AQUANOX A4638 advanced packaging cleaning chemistry.
An engineered semi-aqueous solvent blend, MICRONOX MX2302 has been designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and µBGA packages. Proven to be effective in ultrasonic, centrifugal and semi-aqueous spray under immersion cleaning systems, the easy to use MX2302 has excellent compatibility with all soldering materials, passivation layers (PI, Nitride, Silicon Dioxide, BCB, etc.) and metal layers.
Developed to rapidly dissolve water-soluble polar flux residues, AQUANOX A4638 is combined with Kyzen’s revolutionary inhibition technology to provide superior material compatibility. The engineered electronic assembly and advanced packaging cleaning agent exhibits a low surface tension, is non-hazardous, biodegradable and contains no CFCs or HAPs. The aqueous solution has been designed to remove flux residue from flip chip and low clearance components.
The MICRONOX MX2302 and AQUANOX A4638 cleaning solutions are both available in 25 and 200l (five and 55gal) containers.
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