Home > Products > Highly-compressible TIM guarantees thermal stability up to 400°C

Component Management

Highly-compressible TIM guarantees thermal stability up to 400°C

8th March 2017

Rutronik

Alice Matthews

0 0

Datasheet

Distributor Rutronik has presented a highly-compressible Thermal Interface Material (TIM) from Panasonic, the Soft-PGS. Its 200µm thickness guarantees thermal stability up to 400°C with thermal conductivity up to 400W/mK. Soft-PGS is a 200µm thick graphite sheet designed for use as a thermal interface material for IGBT modules.

It reduces contact thermal resistance between rough surfaces in thin spaces and enhances the thermal coupling between heat producing devices (heat sources), such as IGBT modules, and heat dissipation devices (heat sinks). It features thermal stability of up to 400°C and high reliability against intense heat cycles (-55 to 150°C).

Its thermal conductivity is guaranteed at 400W/mK for X-Y direction and at 30W/mK in Z direction. This thin Soft-PGS sheet is easy to install, and has far lower labour and installation costs compared to thermal grease or phase change material. A wide range of standard sheets for different IGBT modules from various suppliers is available at Rutronik.