Ersa to present selective soldering techniques

14th June 2016

Ersa

Peter Smith

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Kurtz Ersa North America will present at the Advanced Selective Soldering Process Seminar, scheduled to take place Tuesday, June 28^th at Kester’s Global Headquarters in Itasca, IL. Joseph Clure (Application/Process Engineer) will focus on selective soldering, and what techniques can be used in the preheat and solder modules to improve solder quality on difficult soldering applications such as high thermal mass PCBs, high thermal mass components, PCBs with extreme high mass and low mass areas within the same board, and fine-pitch components.

Additionally, he will discuss how to identify which area within a solder joint is preventing a high level of solder quality, so that a suitable technique can be used to improve soldering in this location. Clure will show data of actual preheat cycles performed on various test vehicles using different preheating methods, as well assettings to show how to most effectively use this process for various PCB designs.

Clure is based out of Ersa North America, located in Plymouth, WI. He has more than 15 years of experience in the electronics soldering industry, working with numerous contract manufacturers and OEMs, developing processes for and building products to all classes of IPC and OEM specifications.

Clure held a process engineer position at a large electronics contract manufacturer that is globally known as a leader in the soldering industry where he was the regional selective soldering subject matter expert for all locations in North America and Mexico. Clure holds degrees from Universities in New York, Wisconsin, and the United States Navy’s Nuclear Power Program.