Companies

Yole Développement

  • Le Quartz 75 cours Emile Zola 69100 Lyon-Villeurbanne
    France
  • (33) 04 72 83 01 80
  • http://www.yole.fr/
  • (33) 04 72 83 01 83

Yole Développement Articles

Displaying 221 - 240 of 311
Analysis
20th November 2014
Thin film PZT promises piezoelectric performance

Yole Développement has identified a growing interest for thin film PZT in the semiconductor industry, due to its very promising piezoelectric properties. For example, Epson has released its second generation inkjet head based on thin film PZT for small office applications, proving the maturity of the technology.

Analysis
19th November 2014
The EV/HEV supply chain is evolving

The EV/HEV supply chain is evolving and power electronic module manufacturing attracts more and more companies, car makers, modules suppliers, chip makers... to develop their own expertise, announces Yole Développement, in its latest report 'Power Electronics in Electric and Hybrid Vehicles'. Industrials develop innovative technologies at the substrate, integration and packaging levels, to enhance power module performance and push the EV/H...

Analysis
15th October 2014
Medical image sensor market expected to reach $142m by 2019

A report has been released by Yole Développement which discusses the direct impact of investments, mergers and acquisitions on the solid-state medical image sensor market. The report, titled 'Solid State Medical Imaging: X-ray and Endoscopy', revealed that the medical imaging market is evolving slowly, with 2.1 million units in 2013.

Analysis
13th October 2014
New packaging technologies change LED supply chain

The combination of cost reduction and advanced packaging technologies such as Flip Chip and Chip Scale Package, is changing the LED industry landscape, especially its supply chain, says Yole Developpement in an update to its technology and market analysis, LED Packaging Technology & Market Trends.

Events News
9th October 2014
NCAP China & Yole collaborative event is a success

The 2014 Advanced Packaging & Integration Technology Symposium, organised by NCAP China (National Center for Advanced Packaging) and Yole Développement, was successfully held. Yole is particularly interested in the advanced packaging industry in Greater China and would like to ensure business positioning and increase it's existing network in this geographic area.

Analysis
6th October 2014
More industrial segments adopt SiC technology

Silicon Carbide (SiC) propagates over all industrial segments, announces Yole Développement. Power factor corrector (PFC), photovoltaic inverter, motor control … and more represented a $100 million business in 2013.

Sensors
3rd October 2014
Imaging industry entering maturing phase

“The last months have been very active in term of mergers and acquisitions in the CMOS image sensor (CIS) business”, comments Yole Développement (Yole)...

Optoelectronics
3rd October 2014
Innovative technologies introduction impacts favorably the LED packaging materials market

The LED packaging industry is moving toward further cost reduction and new technologies including Flip Chip and Chip Scale Package (CSP), says Yole Développement in its latest report on packaging for LED: LED Packaging Technology and Market Trends 2014. These market and technology trends directly impact the LED & advanced packaging industry and its supply chain, especially at the material and equipment levels: whereas the equipment mar...

Analysis
19th September 2014
Apple Watches provide sapphire displays but iPhones don't

Apple has announced that its 4.7 and 5.5” iPhone 6 and iPhone 6 plus will both feature a traditional ion-exchange strengthened glass display cover. Sapphire remains in the camera lens cover and the touch ID sensor, features that were already present on the iPhone5s. Yole Développement believes that technical and manufacturing issues in the supply chain have prevented Apple from using sapphire as the display cover in this year's iPhon...

Events News
6th August 2014
Symposium targets the advanced packaging industry

A symposium aimed at leaders of the advanced packaging industry has been organised by Yole Développement (Yole) and the National Center for Advanced Packaging (NCAP China). The event, entitled Advanced Packaging & Integration Technology Symposium, will focus on 3D integration technologies and market trends, interposers activities, roadmaps and key players, MEMS packaging and manufacturing readine...

Analysis
5th August 2014
Large MEMS companies are challenged by low-cost solutions

Yole Développement has published a report describing and analysing MEMS technologies and market trends. The report, entitled 'Status of the MEMS Industry', announces 2013-2019 market data covering more than 220 MEMS applications, with an in-depth study of the industrial and strategic evolutions.

Analysis
25th July 2014
Study confirms uncooled thermal camera market downturn

A recent market study, titled Uncooled Infrared Imaging Technology & Market and compiled by Yole Développement, has confirmed the uncooled thermal camera market downturn in 2013, with -5% CAGR. Overall growth is now driven by low-end applications, requiring much higher cost reduction at both material and manufacturing levels.

Analysis
11th July 2014
Commercial and consumer applications drive infra-red imaging

Existing commercial application and new consumer applications will drive infra-red imaging market growth, according to a new report published by Yole Développement. Under this report, entitled Uncooled Infrared Imaging Technology & Market Trends, 2014 edition, experts analyse the latest industry news, identify new market entrants and give a clear understanding of the impact on the market structure.

Analysis
11th July 2014
When will 3D TSV be used for mainstream consumer applications?

Yole Développement has released a new report '3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update' which provides an overview of the TSV implementation for various devices and packages including memories, logic, MEMS, photonics, CIS and other applications.

Analysis
18th June 2014
IoT devices and the value they offer manufacturers

From $9.5B in 2014 to $46B in 2024, the Internet of Things (IoT) device market will represent close to 15% of all data processing.”IoT devices offer huge potential for electronic component manufacturers, but this is clearly not where the value will stop. Most of the added value in IoT solutions will come from the processing of the generated data”, explains Dr Eric Mounier, Senior Technology & Market Analyst at Yole Développ...

Analysis
7th May 2014
Substrates shape LED front-end industry

In the company's latest report, 'LED Frond-End Manufacturing Trends', Yole Développement provides a better understanding of the current process flow, process steps and technological trends in LED front-end manufacturing. Pars Mukish, Technology and Market Analyst, details the importance of cost reduction and evaluates emerging substrates and related technologies including GaN-on-GaN LEDs and GaN-on-Si LEDs.

Analysis
25th March 2014
GaN-on-Si substrate for LED and power electronics

The GaN-on-Si Substrate Technology and Market for LED and Power Electronics report has been released by Yole Développement. Yole reviews the GaN-on-Si technology growth, challenges and solutions and analysts Dr Hong Lin and Dr Eric Virey give an overview of GaN-on-Si epiwafer playground. This report also provides an in-depth analysis of the GaN-on-Si technology for LED and power electronic applications, including technology and cost aspect...

Analysis
21st February 2014
Patent analysis for non-volatile memories

Focusing on patents in the emerging non-volatile memories market, Yole Développement’s partner, KnowMade, has released the "Emerging Non-Volatile Memories: patent landscape” report. This builds on the information from last year's Yole report: “Emerging Non-Volatile Memories”.

Component Management
4th February 2014
The industrial potential for graphene materials

A 2D material with exceptional properties, graphene is the focus of Yole Développement's latest report: "Graphene materials for opto & electronic applications". With properties including ultrahigh electrical and thermal conductivities, wide-range optical transmittance and excellent mechanical strength and flexibility, graphene is a promising material for emerging and existing applications in printed & flexible circuitry, ultrafast ...

Analysis
27th January 2014
Report urges serious consolidations for fragmented LED industry

A report into the latest status of the LED Industry has found that a number of factors created a a climate of overcapacity, price pressure, and strong competition.

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